Case Studies 20丨From Burr Issue to Process Solution: RF Electrode Case Study

RF electrode aluminum mounts are critical components in semiconductor equipment, where positional accuracy, flatness, and internal surface quality directly affect system performance.

In this project, the customer required tight positional and flatness tolerances, with an additional challenge:
all inner holes had to be completely burr-free and free of tool marks.
While CNC machining met the dimensional requirements, conventional deburring methods could not deliver consistent results inside deep internal features.

To solve this, we introduced Abrasive Flow Machining (AFM) as a secondary process, achieving stable, repeatable, and defect-free internal surfaces without affecting critical dimensions.

Key Manufacturing Challenges

• Burrs and tool marks inside deep internal holes

• High sensitivity to surface defects in semiconductor applications

• Requirement for repeatable results in production, not one-off success

Our Solution & Advantages

Engineering Value

This case shows that in semiconductor components, process selection is as important as machining accuracy.
By combining CNC machining with the right finishing technology, XY-GLOBAL delivers burr-free, high-reliability parts for demanding semiconductor applications.

If you are facing similar internal surface or burr-control challenges, our engineering team can support process evaluation, prototyping, and stable production.